Aug. 25, 2003

Koncent Communication, Inc., a leading fiber optical component manufacturer and supplier, today announced that it has been awarded a US patent with PUB. APP. NO 20030103725 for Packaging Methodology for DWDM and OADM Applications. This invention generally applies to optical communication systems. More specifically, the packaging of components for optical devices, such as wavelength division-multiplexing and optical add-drop modules.

Packaging Methodology for Assembly Automation for DWDM and OADM Modules provides an improved configuration to overcome the difficulties in process automation. Furthermore, it is desirable that the new configurations and method of manufacturing can provide new and further improved optical devices that are not only cheaper to make but also better performance with higher operational reliability.

It is an object of the present invention to provide new configurations and methods of manufacture for producing new optical devices, e.g., for DWDM and OADM applications, at lower cost and achieving full alignment automation and better performance.